发明名称 |
Overmolding encapsulation process |
摘要 |
A method of encapsulating an article having first and second surfaces, includes positioning the article on a carrier such that at least a portion of the first surface contacts the carrier. A portion of the carrier carrying the article is then positioned within a mold and a seal is formed between the mold and the carrier. The mold is then filled with an encapsulating material to form a seal between the article and the carrier.
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申请公布号 |
US6537853(B1) |
申请公布日期 |
2003.03.25 |
申请号 |
US20000652076 |
申请日期 |
2000.08.31 |
申请人 |
MICRON TECHNOLOGY, INC. |
发明人 |
JOHNSON MARK S.;BOLKEN TODD O. |
分类号 |
H01L21/00;H01L21/56;H01L23/29;H01L23/31;(IPC1-7):H01L21/48 |
主分类号 |
H01L21/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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