| 摘要 |
Vibration isolators (56B, 56C) supporting a main column (14) is mounted on a base plate (BP1), and vibration isolators (66B, 66C) supporting a stage supporting bed (16) is mounted independently of the base plate (BP1) on a base plate (BP2) arranged on the floor (FD). Therefore, vibration traveling between the base plates (BP1, BP2) is cut off, and the reaction force produced due to the movement (driving) of a wafer stage (WST) is not the cause of vibration of a projection optical system (PL) supported by the main column (14). Accordingly, a positional shift of the pattern to be transferred or an image blur due to the vibration of the projection optical system (PL) can be effectively avoided, and the exposure accuracy can be improved. Furthermore, it is possible to increase the speed and size of the substrate stage (WST), therefore, the throughput can also be improved.
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