发明名称 Etchant with selectivity for doped silicon dioxide over undoped silicon dioxide and silicon nitride, processes which employ the etchant, and structures formed thereby
摘要 An etchant including C2HxFy, where x is an integer from two to five, inclusive, where y is an integer from one to four, inclusive, and where x plus y equals six. The etchant etches doped silicon dioxide with selectivity over both undoped silicon dioxide and silicon nitride. Thus, undoped silicon dioxide and silicon nitride may be employed as etch stops in dry etch processes which utilize the C2HxFy-containing etchant. C2HxFy may be employed as either a primary etchant or as an additive to another etchant or etchant mixture.
申请公布号 US6537922(B1) 申请公布日期 2003.03.25
申请号 US20000625144 申请日期 2000.07.25
申请人 MICRON TECHNOLOGY, INC. 发明人 KO KEI-YU;LI LI;BLALOCK GUY T.
分类号 H01L21/311;H01L21/768;(IPC1-7):H01L21/302 主分类号 H01L21/311
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