发明名称 Anisotropically conductive adhesive composition and anisotropically conductive adhesive film formed from it
摘要 To provide an anisotropically conductive adhesive composition that can be rapidly cured at a low temperature during thermocompression bonding and has a sufficiently long working life, while also exhibiting excellent mutual connection stability after connection between substrates. The anisotropically conductive adhesive composition comprises an epoxy resin comprising a cycloaliphatic epoxy resin and a glycidyl group-containing epoxy resin, an ultraviolet activatable cationic polymerization catalyst and a cationic polymerization retarder, and conductive particles.
申请公布号 US2003051807(A1) 申请公布日期 2003.03.20
申请号 US20020239375 申请日期 2002.09.19
申请人 YAMAGUCHI HIROAKI;HIROSHIGE YUJI;HATA MICHIRU;KITAMURA TETSU 发明人 YAMAGUCHI HIROAKI;HIROSHIGE YUJI;HATA MICHIRU;KITAMURA TETSU
分类号 C08G59/22;C08G59/24;C09J7/00;C09J163/00;H01B1/22;H01B1/24;H05K3/32;(IPC1-7):B32B31/00;B32B31/26 主分类号 C08G59/22
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