发明名称 |
Anisotropically conductive adhesive composition and anisotropically conductive adhesive film formed from it |
摘要 |
To provide an anisotropically conductive adhesive composition that can be rapidly cured at a low temperature during thermocompression bonding and has a sufficiently long working life, while also exhibiting excellent mutual connection stability after connection between substrates. The anisotropically conductive adhesive composition comprises an epoxy resin comprising a cycloaliphatic epoxy resin and a glycidyl group-containing epoxy resin, an ultraviolet activatable cationic polymerization catalyst and a cationic polymerization retarder, and conductive particles.
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申请公布号 |
US2003051807(A1) |
申请公布日期 |
2003.03.20 |
申请号 |
US20020239375 |
申请日期 |
2002.09.19 |
申请人 |
YAMAGUCHI HIROAKI;HIROSHIGE YUJI;HATA MICHIRU;KITAMURA TETSU |
发明人 |
YAMAGUCHI HIROAKI;HIROSHIGE YUJI;HATA MICHIRU;KITAMURA TETSU |
分类号 |
C08G59/22;C08G59/24;C09J7/00;C09J163/00;H01B1/22;H01B1/24;H05K3/32;(IPC1-7):B32B31/00;B32B31/26 |
主分类号 |
C08G59/22 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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