| 发明名称 |
Resin sealing apparatus and resin sealing method |
| 摘要 |
The resin sealing apparatus includes a mold that has a main cavity into which a portion of a semiconductor device to be sealed with a resin is disposed. Furthermore, an external-shape regulating member is detachably accommodated in the main cavity of the mold to form a new cavity inside the main cavity. |
| 申请公布号 |
US2003052418(A1) |
申请公布日期 |
2003.03.20 |
| 申请号 |
US20020091303 |
申请日期 |
2002.03.06 |
| 申请人 |
MITSUBISHI DENKI KABUSHIKI KAISHA |
发明人 |
YASUDA NAOYA |
| 分类号 |
B29C45/37;B29K105/22;B29L31/34;H01L21/56;(IPC1-7):H01L23/28 |
主分类号 |
B29C45/37 |
| 代理机构 |
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代理人 |
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| 主权项 |
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| 地址 |
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