INTEGRATED COOLER FOR ELECTRONIC DEVICES

摘要

The integrated cooler for electronic devices (1) of this invention provides at least one heat exchange element (2), at least one heat transferring element (3), a blower (4) and an electric drive (5). The at least one heat exchange element (2) comprises a heat spreading base (6) and heat exchanging means (7) made on a surface of the base (6). The heat spreading base (6) providing thermal contact with the at least one heat transferring element (3). The blower (4) comprises a blower inlet (8) and a blower outlet (9), which are directly connected to ambient air, so that the integrated cooler for electronic devices (1) becomes a hydraulically sealed unit and a drum type radial impeller (10) that is mounted on an axle (11) and comprises at least one impeller disk (12) and blades (13) attached to the at least one impeller disk (12). The blower (4) is positioned on the heat exchange element (2) so that the heat exchanging means (7) being located at the blower outlet (9) and/or at the blower inlet (8). The electric drive comprises a rotor (14) and at least one stator (15). The rotor (14) made as drum type radial impeller (10) having circumferential arrayed magnetic means (16) magnetized in the direction parallel to said axle (11). The stator (15) comprises circumferential arrayed coils (17) etched on circuit board metal layers (18) and numbers of the coils is divisible in respect to numbers of the magnetic means, said coils (18) being spaced axially from the magnetic means of the impeller. The blower (4) is a cross flow type blower. The heat exchanging means (7) are pins (19) and/or fins (20).