| 摘要 |
<p>The present invention relates to an integrated circuit, comprising: - a substrate with a first (semi-)conductive region arranged in or on the substrate; - a second (semi-)conductive region which is isolated for at least a considerable part relative to the first region and is arranged above or adjacent to the first region; - a third (semi-)conductive region which is insulated for at least a considerable part relative to the first and second (semi-)conductive regions and is arranged thereabove; - a fourth (semi-)conductive region which is insulated relative to the first, second and third (semi-)conductive regions and is arranged thereabove; and - a (semi-)conductive interconnection contact (17) which mutually connects said four (semi-)conductive regions (semi-)conductively, wherein at least two of the four (semi-)conductive regions extend substantially parallel to the substrate of the integrated circuit at a considerable lateral angle relative to each other.</p> |
