| 摘要 |
A method for installing an electronic component on a support or carrier structure (1), in which the component is joined in its installed position through an adhesive layer (3) at its structured side facing the carrier structure with the surface of the carrier structure. The adhesive layer (3) is mounted in a first working step on the bottom face of the component and in a further working step prior to curing the adhesive layer (3), and subsequently a material aggregate (4) of the conducting material is applied for forming the contact bridge by an injection process at high-speed, onto the pad (2), such that in the region of the pad (2) the adhesive layer material is dispelled and after placing the processed component into the required position on the carrier structure (1), simultaneous curing of the adhesive layer and the electronic, conducting contact bridges (bumps) follows.
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