| 摘要 |
A carrier 11 carries a broken wafer W between an unloading table 10 and a test position through a pair of tweezers 4 having a vacuum suction mechanism, and a main chuck 6. The carrier 11 comprises a first groove 111 formed in the first surface 11B of the carrier, a first through hole 112 formed to correspond to a first opening 4A in the tweezers 4 and open to the first groove 111, second grooves 113 formed in the second surface 11C formed to correspond to the adsorption groove 6A of a main chuck 6, and a second through hole 114 establishing communication between the first and second grooves 111, 113.
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