METHOD OF MANUFACTURING PRINTED WIRING BOARD

摘要

PROBLEM TO BE SOLVED: To provide a method of manufacturing a printed wiring board by which conductor circuits can be formed nicely by reducing the occurrence of short-circuiting faults between conductor circuits at the time of forming conductor circuit patterns on a printed board by a semi-additive method. SOLUTION: Interlayer insulating resin layers 14 to which copper foil 13 manufactured at a current density higher than that set at the time of forming electroplated copper layers which become the conductor circuit patterns and having a thickness of <=5μm is stuck are respectively laminated upon the upper and lower surfaces of the internal circuit board 11 of the printed wiring board. In addition, an etchant containing a halogen-free acid and hydrogen peroxide as main components is used for etching copper in portions other than the conductor circuit patterns.