发明名称 MICROWAVE CIRCUIT
摘要 PROBLEM TO BE SOLVED: To provide a microwave circuit in which the generation of cracks or the like of a surface protecting film is prevented. SOLUTION: The microwave circuit is provided with a semiconductor substrate 11 in which a penetrating hole 12 penetrating vertically is formed, a rear conducting layer 13 formed on an internal surface of the penetrating hole 12, an electrode pattern 14 connected electrically with the rear conducting layer 13, and the surface protective film 18 formed on the semiconductor substrate 11. A gap 19 is formed between the electrode pattern 14 and the surface protective film 18.
申请公布号 JP2003086605(A) 申请公布日期 2003.03.20
申请号 JP20010271561 申请日期 2001.09.07
申请人 TOSHIBA CORP 发明人 SENJU TOMOHIRO;ASANO TAKASHI;ARAI KAZUHIRO
分类号 H01L29/41;H01L21/338;H01L29/812;(IPC1-7):H01L21/338 主分类号 H01L29/41
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