JET TYPE SOLDERING DEVICE

摘要

PROBLEM TO BE SOLVED: To make easier the maintenance of a jet type soldering device which solders electronic parts mounted on a mounting substrate to the substrate by enabling parts to be fixed to be discovered and recovered quickly by making the parts float up on the surface of molten solder when the parts get out of a solder bath even when the parts use an inexpensive material. SOLUTION: The jet type soldering device is provided with the solder bath 3 containing molten solder and solders the electronic parts mounted on the mounting substrate to the substrate by dipping the soldered surface of the substrate in the molten solder. At least bolts 11 used for fixing solder jetting nozzles 10 provided in the solder bath 3 constitute a hollow structure so that an apparent specific gravity as the follow structure becomes smaller than that of the solder.