| 摘要 |
PROBLEM TO BE SOLVED: To reduce the warpage of a substrate due to its own weight, to prevent the collision or the friction of a substrate against or with a cleaning nozzle. SOLUTION: The substrate end face cleaner enables the surface periphery to be cleaned while approximately a central portion of the substrate 1 is supported with a substrate vacuum chuck 2. The support position of the periphery of the chuck 2 is located in a range of 30 mm from the substrate end face to reduce the warpage of the substrate 1 due to its own weight, thereby preventing the collision or the friction of the substrate against or with a cleaning nozzle 3, etc., for cleaning the substrate periphery. This eliminates the need for stopping the operation of the cleaner for removing the substrate 1 damaged by the collision or the friction of the substrate 1 against or with the nozzle 3 or for repairing the damaged cleaning nozzle 3, and hence improves the availability factor of the cleaner.
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