| 摘要 |
<p>A method for accurately automatically teaching the position of a semiconductor wafer without resorting to the operator’s eyesight; and a teaching jig used in this method. To this end, a teaching jig (11) is detected by a first permeation sensor (6) disposed at the front end of the wafer gripper (5) of a robot. Further, the teaching jig (11)is comprised of a large circular plate (12) equal in outer diameter to the semiconductor wafer, and a small circular plate (13) coaxial with the large circular plate (12). Further, a second permeation sensor (18) is installed on the wafer gripper (5) to detect the teaching jig (21). Further, the second permeation sensor (18) may be mounted on a sensor jig (15) so that it is moutable on and dismoutable from the wafer gripper (5).</p> |
