| 摘要 |
PROBLEM TO BE SOLVED: To obtain a method and a device for mounting a component while enhancing the planar accuracy of component mounting face of an electronic circuit board. SOLUTION: The substrate positioning device 60 comprises a substrate clamp means, e.g. clampers 621 and 633, for clamping an electronic circuit board B at the opposite side parts Bp thereof on the inner side of the opposite side edge parts Be, an external force imparting means, e.g. a second belt guide 64 and a spring 65, for applying an external force for warping the electronic circuit board B downward to the opposite sided edge parts Be thereof, and a substrate pressing means, e.g. an air cylinder 52 and a backup pin 54, for regulating the component mounting face Ba of the electronic circuit board B to planar state by pressing the non-component mounting face Bb of the electronic circuit board B starting to warp downward from the non-component mounting face Bb side through cooperation of the substrate clamp means and the external force imparting means.
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