| 发明名称 |
High-g mounting arrangement for electronic chip carrier |
| 摘要 |
A chip carrier is coupled to a printed circuit board by leads so that the chip carrier stands off from the printed circuit board. A spacer is provided between the chip carrier and the printed circuit board. The spacer reduces g forces on the leads.
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| 申请公布号 |
US2003053301(A1) |
申请公布日期 |
2003.03.20 |
| 申请号 |
US20020261015 |
申请日期 |
2002.09.30 |
| 申请人 |
KNOWLES GARY R. |
发明人 |
KNOWLES GARY R. |
| 分类号 |
H05K3/34;H01L21/58;H05K1/18;H05K3/30;(IPC1-7):H05K7/02;H05K7/06;H05K7/08;H05K7/10 |
主分类号 |
H05K3/34 |
| 代理机构 |
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代理人 |
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| 主权项 |
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| 地址 |
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