发明名称 Method for manufacturing capacitor of semiconductor memory device controlling thermal budget
摘要 A method for manufacturing a capacitor of a semiconductor memory device by controlling thermal budgets is provided. In the method for manufacturing a capacitor of a semiconductor memory device, a lower electrode is formed on a semiconductor substrate. The lower electrode is heat-treated with a first thermal budget. A dielectric layer is formed on the heat-treated lower electrode. The dielectric layer is crystallized by heat-treating the dielectric layer with a second thermal budget which is smaller than the first thermal budget.
申请公布号 US2003054605(A1) 申请公布日期 2003.03.20
申请号 US20020105181 申请日期 2002.03.25
申请人 SAMSUNG ELECTRONICS CO., LTD. 发明人 KIM WAN-DON;YOO CHA-YOUNG;HWANG DOO-SUP;JOO JAE-HYUN;CHUNG EUN-AE;JEONG YOUG-KUK
分类号 H01L27/04;H01L21/02;H01L21/314;H01L21/316;(IPC1-7):H01L21/823;H01L21/824;H01L21/20 主分类号 H01L27/04
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