| 摘要 |
PROBLEM TO BE SOLVED: To provide a high-frequency circuit package using a multilayer substrate with a high limit on a resonance frequency due to a waveguide mode. SOLUTION: The high-frequency circuit package comprises a cavity 1p formed in a main body of the package which is formed of the multilayer substrate, a monolithic microwave integrated circuit 1a mounted inside the cavity 1p, and a plurality of half-split via holes 1q. Each of the half-split via holes 1q is plated on the inner surface, and has such a shape that a half-split section 1q2 having a semicircular cross section is extended into a via hole 1q1 connected to the ground. The half-split sections 1q2 are disposed at a plurality of places on the peripheral wall surface 1p1 of the cavity 1p. Each of the half-split sections 1q2 of the half-split via holes 1q is half-split by the peripheral wall surface 1p1 of the cavity 1p, and is located in a dielectric substrate. |
