| 摘要 |
PROBLEM TO BE SOLVED: To provide a method for separating a die from a semiconductor wafer by manufacturing a semiconductor die which is free from the generation of contaminating particles and a method for removing a material from the rear side of a wafer and fixing a semiconductor device to a surface. SOLUTION: One or a plurality of channels (214) are etched between individual die regions (204) in an upper side (206) of a wafer (202). A material is then removed from the rear side (208) of a wafer for separating the individual dies. A method is also disclosed for removing a material from the rear side of a die of a wafer. A contoured surface (280) is provided to the rear of a die through an etching process or the like. A semiconductor wafer and a die have contoured rear surfaces. |
