METHOD OF MANUFACTURING MULTILAYERED PRINTED WIRING BOARD

摘要

PROBLEM TO BE SOLVED: To provide a method by which a multilayered printed wiring board that is improved in thermal reliability can be manufactured by using specific metal foil and a specific thermosetting resin for a metal foil-clad laminated board and prepreg. SOLUTION: A highly reliable multilayered printed wiring board is obtained by using a resin having a glass transition point of >=165 deg.C and a pyrolysis starting temperature of >=345 deg.C as the matrix resin used for forming the metal foil-clad laminated board and prepreg. In addition, metal foil having a thickness of <=0.035 mm and an elongation percentage of >=12% at 180 deg.C is used for the metal foil-clad laminated board.