ELECTRONIC COMPONENT AND MANUFACTURING METHOD THEREOF, AND PACKAGED BODY AND PACKAGING METHOD FOR ELECTRONIC COMPONENT

摘要

PROBLEM TO BE SOLVED: To provide a packaged body of electronic components having a narrow pitch and improved bonding strength and reliability according to a conventional infrastructure at a low cost. SOLUTION: Electrically conductive bumps 6 are formed on the electrodes of a wafer level package having rewiring layers 2 using an insulating resin on a bare semiconductor chip 1. A melt-bonded layer 7 as a resin layer is formed around the electrically conductive bumps 6 so that the distortion stress caused by the difference of thermal expansion coefficients of the electronic component, and a mother board 3 is alleviated by the cured melt-bonded layer 7 to obtain the packaged body having a narrow pitch and improved reliability in connections. Further, when heated for packaging, the molten electrically conductive bumps 6 are prevented from flowing to adjacent electrodes through the cured melt-bonded layer 7.