发明名称 CHIP MANUFACTURING METHOD AND SYSTEM, CIRCUIT SUBSTRATE AND CIRCUIT CHIP
摘要 PROBLEM TO BE SOLVED: To prevent an unauthorized access of a user to an integrated circuit from a test pad of a circuit chip. SOLUTION: First and second divided lines 103, 104 are set in parallel on one side of a rectangular integrated circuit 101 formed on a circuit substrate 100, and a test wire 105 and a test pad 106 are positioned between gaps thereof. After the circuit substrate 100 is cut apart the first divided line 103, a circuit test is executed. After this is completed, a portion outside the second divided 104 is cut off from a circuit chip 110. The test pad 106 is present in the circuit chip 110 on which the circuit test is executed, but the test pad 106 is absent in the circuit chip 110 which is shipped after completion.
申请公布号 JP2003086643(A) 申请公布日期 2003.03.20
申请号 JP20010277877 申请日期 2001.09.13
申请人 NEC MICROSYSTEMS LTD 发明人 AZUMA KUNIHIKO
分类号 G01R31/26;G01R31/28;H01L21/66;H01L23/58;(IPC1-7):H01L21/66 主分类号 G01R31/26
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