发明名称 Composite material
摘要 A composite material has SiC produced by preliminarily sintering a porous body having a coefficient of thermal expansion lower than the coefficient of thermal expansion of copper to construct a network therein, the SiC being impregnated with a copper alloy. The copper alloy comprises copper and one or more additive elements which are prepared to impart a coefficient of thermal conductivity of 160 W/mK or higher to the composite material. The additive elements comprise up to 5% of at least one element selected from Be, Al, Si, Mg, Ti, Ni, Bi, Te, Zn, Pb, Sn, and mish metal, and also contains unavoidable impurities and gas components.
申请公布号 US2003054188(A1) 申请公布日期 2003.03.20
申请号 US20020245999 申请日期 2002.09.18
申请人 NGK INSULATORS, LTD. 发明人 ISHIKAWA SHUHEI;MITSUI TSUTOMU;SUZUKI KEN;NAKAYAMA NOBUAKI;TAKEUCHI HIROYUKI;YASUI SEIJI
分类号 C04B41/88;B32B15/04;C04B41/51;C04B41/52;C04B41/90;C22C1/10;C22C9/00;C22C9/01;C22C9/05;C22C9/06;C22C9/10;H01L21/48;H01L23/15;H01L23/373;(IPC1-7):B32B15/04 主分类号 C04B41/88
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