发明名称 |
INTEGRATED CIRCUIT, PORTABLE DEVICE AND METHOD FOR MANUFACTURING AN INTEGRATED CIRCUIT |
摘要 |
The present invention relates to an integrated circuit, comprising: - a substrate with a first (semi-)conductive region arranged in or on the substrate; - a second (semi-)conductive region which is isolated for at least a considerable part relative to the first region and is arranged above or adjacent to the first region; - a third (semi-)conductive region which is insulated for at least a considerable part relative to the first and second (semi-)conductive regions and is arranged thereabove; - a fourth (semi-)conductive region which is insulated relative to the first, second and third (semi-)conductive regions and is arranged thereabove; and - a (semi-)conductive interconnection contact which mutually connects said four (semi-)conductive regions (semi-)conductively, wherein at least two of the four (semi-)conductive regions extend substantially parallel to the substrate of the integrated circuit at a considerable lateral angle relative to each other. |
申请公布号 |
WO03023847(A2) |
申请公布日期 |
2003.03.20 |
申请号 |
WO2002IB03628 |
申请日期 |
2002.09.03 |
申请人 |
KONINKLIJKE PHILIPS ELECTRONICS N.V. |
发明人 |
REINER, JOACHIM, C.;GRADENWITZ, PAUL, G., M. |
分类号 |
H01L21/768;H01L23/485;H01L27/11 |
主分类号 |
H01L21/768 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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