发明名称 Halbleitervorrichtung
摘要 A bolt (42a) is connected to a copper plate (9a) by a first electrode (51a), a second electrode (52a) and a wire (10a) for connecting the first and second electrodes. Similarly, a bolt (42b) is connected to a copper plate (9b) by a first electrode (51b), a second electrode (52b) and a wire (10b) for connecting the first and second electrodes. The wires (10a, 10b) are flexible and made of aluminum, for example. Electrical connection can be kept and the upper bound of absorption of the stress applied between the bolts (42a, 42b) and the copper plates (9a, 9b) can be increased.
申请公布号 DE19634202(C2) 申请公布日期 2003.03.20
申请号 DE1996134202 申请日期 1996.08.23
申请人 MITSUBISHI DENKI K.K., TOKIO/TOKYO 发明人 MATSUMOTO, HIDEO
分类号 H01L23/473;H01L23/48;H01L25/07;H01L25/18 主分类号 H01L23/473
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