Connecting opto-electrical module with semiconductor casing using wire bonding needles and adhesive material

摘要

A wire bonding needle (204) is constructed on an electrical contact surface. The latter is located on top of the semiconductor component casing. An adhesive material is applied to the needle. The optical component casing is arranged on the semiconductor component casing to make contact between the adhesive and the contact surface. The adhesive is hardened completing attachment. Adhesive is applied to a wire bonding needle through a templet which is located over the upper surface of the casing. The adhesive is screen printed onto the upper surface of the semiconductor component casing through the templet.