发明名称 THERMOELECTRIC COOLING SYSTEM
摘要 A thermoelectric cooling system (10) includes a control unit (70) and a power source (66) providing current to an interface (18) that creates a thermal flow across a thermoelectric module having at least one heat sink (16) and at least one heat source (14). The power source (66), the interface (18), the control unit (70), and the thermoelectric module are connected to each other in series. The control unit (70) optionally includes a relay (73) and a voltage generating thermocouple (180). When voltage from the thermocouple (180) reaches a predetermined threshold, the relay (73) trips and supplies sufficient voltage to the interface to prevent thermal reversal of the heat source (14) and heat sink (16). To control moisture, a metal strap (184) may be used to restrict heat flow. Alternatively or additionally, a moisture control pad (186) may be used to absorb and re-evaporate moisture to substantially maintain a desired humidity range. In an optional embodiment, the load to be cooled may be placed below the heat source (14) and cooled by convection.
申请公布号 WO03023294(A2) 申请公布日期 2003.03.20
申请号 WO2002US28346 申请日期 2002.09.06
申请人 OPHIRA, INC. 发明人 BIELINSKI, GEORGE
分类号 F24F5/00;F25B21/02;F25D11/00;F25D17/04;F25D31/00;H01L35/00;H01L35/28 主分类号 F24F5/00
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