| 摘要 |
<p>Each multilayer module (10) of a plurality of multilayer modules has a plurality of layers (20) wherein each layer has a substrate (22) therein. The plurality of multilayer modules (10) includes a first multilayer module (10) including a first layer (20) and a second multilayer (10) module including a second layer (20) each having a top side and bottom side. The first layer (20) and second layer (20) each includes a substrate (22), at least one electronic element (26), and a plurality of electrically-conductive traces (28). The plurality of multilayer modules (10) further includes a heat-separating layer (40) disposed between the top side of the first layer (20) and the bottom side of the second layer (20). The first multilayer module (10) is adhered to the second multilayer module (10) and the first multilayer module (10) can be detached from the second multilayer module (10) by applying heat to the heat-separating layer (40).</p> |
