| 摘要 |
An entirely molded semiconductor apparatus in which a flexible sheet having a conductive pattern is employed as a supporting substrate and semiconductor elements are assembled thereon has been developed, wherein such a semiconductor apparatus has various problems by which no multi-layered connection structure is enabled, and warping of insulation resin sheets becomes remarkable in the fabrication process. Therefore, a circuit device and a method for fabricating the same according to the invention solves the above-described and other problems by the structure, wherein an insulation resin sheet in which the first conductive layer 3 and the second conductive layer 4 are adhered to each other by insulation resin 2 is used, the first conductive path layer 5 is formed by the first conductive layer 3, the second conductive path layer 6 is formed by the second conductive layer 4, and both of the conductive path layers are connected by multi-layer connecting means 12. Since a semiconductor element 7 is adhered to and fixed on overcoating resin 8 that covers the first conductive path layer 5, a multi-layer connection structure can be achieved by the first conductive path layer 5 and the second conductive path layer 6. Also, since the second conductive layer 4 which is formed to be thick is thinly etched after molding, the second conductive path layer 6 can be finely patterned.
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