| 摘要 |
A thick film circuit connection epoxy is provided for protecting connections of dissimilar metals in a thick film substrate from the effects of oxidation. In the fabrication of hybrid integrated circuits, aluminum leads on the integrated circuit die are connected to gold conductors on the thick film substrate by means of an ultrasonic weld. The present invention comprises disposing a silver-filled thermoplastic epoxy around the weld between the aluminum wire and the gold conductor. Physical and electrical integrity of the connection between the aluminum wire and the gold conductor is thus maintained, even if the weld fails due to oxidation at elevated operating temperatures. |
