发明名称 |
Method and apparatus for optical endpoint detection during chemical mechanical polishing |
摘要 |
A method for detecting during a planarization process the removal of a first layer of material overlying a workpiece is provided. Relative motion is effected between the first layer and a working surface to remove the first layer. A light having a spectrum of wavelengths is transmitted to the workpiece. The intensity for each of a plurality of reflected wavelengths of a reflected light reflected from the workpiece is measured to obtain a spectrum. The spectrum is a function of the plurality of reflective wavelengths. A spectrum reference value is calculated and a plurality of spectrum difference values are calculated by subtracting the spectrum reference value from the spectrum. An absolute value for each of the plurality of spectrum difference values that is a function of one of the plurality of reflected wavelengths that falls within a selected range of wavelengths is summed together to obtain a delta value. An endpoint parameter is calculated from the delta value.
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申请公布号 |
US2003053042(A1) |
申请公布日期 |
2003.03.20 |
申请号 |
US20010941109 |
申请日期 |
2001.08.28 |
申请人 |
CHEN CHARLES |
发明人 |
CHEN CHARLES |
分类号 |
B24B37/04;B24B49/12;H01L21/306;(IPC1-7):G01N21/17 |
主分类号 |
B24B37/04 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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