发明名称 |
DRESSING TOOL, DRESSING DEVICE, DRESSING METHOD, PROCESSING DEVICE, AND SEMICONDUCTOR DEVICE PRODUCING METHOD |
摘要 |
A dressing device DA is comprised of a pad holding mechanism 10 for holding and rotating a grinding pad 15 having a doughnut disk-shaped pad surface 15a, a dressing tool 2 having a substantially rectangular dressing surface 3, and a dressing tool holding mechanism 1 for holding the dressing tool 2 with the dressing surface 3 opposed to the pad surface 15a of the grinding pad 15 held and rotated by the pad holding mechanism 10. The dressing tool holding mechanism 1 abuts dressing tool 2 held therein against the pad surface 15a to effect dressing with the widthwise centerline L1 of the dressing surface 3 directed to extend radially of the pad surface 15a. This makes it possible to improve the flatness of the processed surface after dressing.
|
申请公布号 |
WO03022523(A1) |
申请公布日期 |
2003.03.20 |
申请号 |
WO2002JP09022 |
申请日期 |
2002.09.05 |
申请人 |
NIKON CORPORATION;HOSHINO, SUSUMU;YAMAMOTO, EIICHI;MITSUI, TAKAHIKO |
发明人 |
HOSHINO, SUSUMU;YAMAMOTO, EIICHI;MITSUI, TAKAHIKO |
分类号 |
B24B53/007;B24B53/017;(IPC1-7):B24B53/12;B24B37/00;H01L21/304;B24B53/02 |
主分类号 |
B24B53/007 |
代理机构 |
|
代理人 |
|
主权项 |
|
地址 |
|