发明名称 DRESSING TOOL, DRESSING DEVICE, DRESSING METHOD, PROCESSING DEVICE, AND SEMICONDUCTOR DEVICE PRODUCING METHOD
摘要 A dressing device DA is comprised of a pad holding mechanism 10 for holding and rotating a grinding pad 15 having a doughnut disk-shaped pad surface 15a, a dressing tool 2 having a substantially rectangular dressing surface 3, and a dressing tool holding mechanism 1 for holding the dressing tool 2 with the dressing surface 3 opposed to the pad surface 15a of the grinding pad 15 held and rotated by the pad holding mechanism 10. The dressing tool holding mechanism 1 abuts dressing tool 2 held therein against the pad surface 15a to effect dressing with the widthwise centerline L1 of the dressing surface 3 directed to extend radially of the pad surface 15a. This makes it possible to improve the flatness of the processed surface after dressing.
申请公布号 WO03022523(A1) 申请公布日期 2003.03.20
申请号 WO2002JP09022 申请日期 2002.09.05
申请人 NIKON CORPORATION;HOSHINO, SUSUMU;YAMAMOTO, EIICHI;MITSUI, TAKAHIKO 发明人 HOSHINO, SUSUMU;YAMAMOTO, EIICHI;MITSUI, TAKAHIKO
分类号 B24B53/007;B24B53/017;(IPC1-7):B24B53/12;B24B37/00;H01L21/304;B24B53/02 主分类号 B24B53/007
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