| 摘要 |
<p>PROBLEM TO BE SOLVED: To provide a semiconductor device capable of coping with a multi-pin trend without increasing a chip size. SOLUTION: This semiconductor device comprises (a) an IC chip having a plurality of pads in staggered arrangement on the periphery thereof, wherein a plurality of pads including a first group of pads arranged on the outer peripheral side and a second group of pads arranged on the inner peripheral side satisfy the condition WP>=PP, where WP denotes a pad pitch and PP denotes the width of each pad, and (b) a tape carrier comprising an insulating film with a wiring pattern of conductors formed thereon, and having a first group of inner leads connected to the first group of pads respectively and a second group of inner leads connected to the second group of pads respectively, wherein the second group of inner leads satisfy the condition WL<2PP-WP, where WL denotes the width of the second group of inner leads.</p> |
