| 摘要 |
<p>PROBLEM TO BE SOLVED: To provide a means for preventing the generation of a lift-off phenomenon when an electronic component having leads is connected by soldering according to a flow process using lead-free solder. SOLUTION: In the figure, (a) shows an overall image of the electronic component, (b) shows a sectional view through a lead 6 of the electronic component, and (c) shows a perspective side elevation of the lead 6. As shown in the figure, this embodiment is a constitution example wherein the lead 6 of the electronic component is divided into four partial leads showing that the lead 6 can be divided into a plurality of partial leads. The reason why one lead is divided into a plurality of partial leads as in this embodiment is that, when soldering is carried out according to the flow process using lead-free solder, the stress generated when the solder is cooled is alleviated by the deformation of individual partial leads to prevent the generation of the lift-off phenomenon.</p> |
