| 摘要 |
PROBLEM TO BE SOLVED: To provide a multilayer wiring substrate in which adhesion of an insulating resin layer to a wiring circuit conductor layer is rigid and which has high reliability, and to provide a method for manufacturing the same. SOLUTION: The method for manufacturing the multilayer wiring substrate comprises a step of partly removing a surface layer of an organic material insulating layer 3 in which numerous bubbles are mixed and which is provided between a first wiring circuit conductor layer 1 and a second wiring circuit conductor layer 5 by chemical treatment, plasma treatment, laser irradiation or the like to a rugged state. Thus, the adhesion off the layer 3 to the second conductor layer is made rigid by its anchoring effect to enhance its reliability. |
