摘要 |
A DRAM module package, which uses a board on chip (BOC) manner to form multiple windows on the module printed circuit board (PCB). A chip is directly adhered to a backside of the module PCB and the bonding pads of the chip are arranged to be located at a center of the windows. The conductive wire penetrates through the window and connects crossing between a mounting pad in front of the module PCB and the bonding pad of the chip. Then, an encapsulation process is performed to protect the conductive wires, the mounting pads on the module PCB, the chip and the bonding pads.
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