发明名称 Dram module package
摘要 A DRAM module package, which uses a board on chip (BOC) manner to form multiple windows on the module printed circuit board (PCB). A chip is directly adhered to a backside of the module PCB and the bonding pads of the chip are arranged to be located at a center of the windows. The conductive wire penetrates through the window and connects crossing between a mounting pad in front of the module PCB and the bonding pad of the chip. Then, an encapsulation process is performed to protect the conductive wires, the mounting pads on the module PCB, the chip and the bonding pads.
申请公布号 US2003051908(A1) 申请公布日期 2003.03.20
申请号 US20010967714 申请日期 2001.09.27
申请人 HO KAI-KUANG 发明人 HO KAI-KUANG
分类号 G11C5/00;H01L23/13;H01L23/31;H01L23/495;H01L25/065;(IPC1-7):H05K7/06 主分类号 G11C5/00
代理机构 代理人
主权项
地址