SEMICONDUCTOR PACKAGE

摘要

A packaged semiconductor device (10) that is fabricated with a plurality of conductive leads (30) defined in a strip that beneficially includes a radio frequency shield box (16). The conductive contacts are located in a housing (12), beneficially by insert molding or by sandwiching between a bottom piece and a top piece. The housing can receives another semiconductor device. Bonding conductors (53) electrically connect at least one semiconductor device (14) to another semiconductor device (18) and/or to the conductive contacts. A conductive cover (28) is disposed over the housing. The cavity (20) beneficially includes a beveled wall (38) and the conductive leads and the radio frequency shield are beneficially comprised of copper.