| 摘要 |
PROBLEM TO BE SOLVED: To provide technique which can form suitably an electronic component having a form wherein conductor is protruding for a small length from a resin package. SOLUTION: This method for manufacturing an electronic component has a form wherein an electronic element electrically connected with a plurality of conductors is sealed with the resin package, and at least one conductor out of the plural conductors protrudes from the package for a small length. The electronic component is manufactured by using a frame 6 for manufacturing wherein a plurality of electronic component forming regions are set and a plurality of conductor members 62, 63 to be turned into conductors for each electronic component forming region are formed. After a semiconductor chip 3 is mounted on each of the forming regions, at least one of the conductor members 62, 63 out of the plural conductor members are protruded and the resin package 5 is formed. After a recessed part 65 is formed in a part position very adjacent to the resin package 5 in the conductor members 62, 63, the members are cut out. |
