发明名称 CIRCUIT FORMING SUBSTRATE
摘要 <p>PROBLEM TO BE SOLVED: To provide a circuit forming substrate with which a circuit that is reduced in impedance change caused by frequency changes can be obtained even when a capacitor having a large electrostatic capacity is used. SOLUTION: Since resistant coating films 51 and 52 are formed on the surfaces of lands 7 and 8 in a circuit pattern and used as resistors connected in series with a capacitor 12, the resistors are connected in series with the capacitor 12 without increasing inductance. Consequently, a circuit which is reduced in impedance change caused by frequency changes can be obtained even when a capacitor having a large electrostatic capacity is used. Therefore, a power source circuit, etc., which is stabilized in operation and has a high speed of response can be obtained.</p>
申请公布号 JP2003086927(A) 申请公布日期 2003.03.20
申请号 JP20010276336 申请日期 2001.09.12
申请人 MURATA MFG CO LTD 发明人 TANIGUCHI MASAAKI;KITAMURA HIDEKAZU
分类号 H05K1/16;H01L27/01;H05K1/02;H05K1/18;H05K3/24;H05K3/32;H05K3/34;(IPC1-7):H05K3/34 主分类号 H05K1/16
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