| 摘要 |
<p>PROBLEM TO BE SOLVED: To provide a method and a device for pasting a protective film in which productivity can be enhanced in the work for pasting a protective film to one side of a silicon wafer. SOLUTION: From a three-layer film H3 produced by laminating a reinforcing film 3 and a carrier film 19 to the surface and rear of a protective film 2, the carrier film 19 is separated to obtain a two-layer film H2 which is pasted to the surface of a silicon wafer 1. Subsequently, the reinforcing film 3 is stripped from the two-layer film H2 and the protective film is trimmed. The pasting device comprises a means B for feeding the three-layer film H3, a means C for separating the carrier film 19 from the three-layer film H3 and winding, a means D for applying/separating the two-layer film H2 to/from the silicon wafer, a means E for bonding the two-layer film H2 onto the silicon wafer, and a means F for winding the reinforcing film while separating from the two-layer film H2.</p> |
