COOLING UNIT OF ELECTRONIC COMPONENT

摘要

PROBLEM TO BE SOLVED: To provide a cooling unit of electronic component whose capability of radiating heat generated from a higher-heating electronic component is improved and which is made compact and lightweight. SOLUTION: The cooling unit is provided with a heatsink which has several fins on the top of a heat transmitting plate in contact with a heating element 3 to be cooled, and whose effect of diffusing heat from the heating element is increased by forming its heat transmitting plate in such a way that its thickness of the section perpendicular to the heat receiving surface is gradually increased at least from one side to the other and is provided with a fan for ventilation on the top of the heatsink. Its air evacuating capability is increased by arranging the second slit of the heatsink only approximately directly below the blades of the cooling fan on both sides of the heat transmitting plate.