| 摘要 |
<p>A conductor composition which comprises a paste or an ink containing a metal powder as a main component, wherein the metal powder is substantially composed of fine particles which comprises Ag or an alloy having Ag as a primary component and is coated with an organic metal compound, preferably a metal salt of an organic acid, a metal alkoxide or a chelate compound, of a metal selected from the group consisting of Al, Zr, Ti, Y, Ca, Mg and Zn. The composition is capable of forming a film conductor exhibiting the resistance to soldering heat at a level satisfactory for practical use, without the use of a great amount of an expensive noble metal such as Pd or the application of another treatment such as a nickel plating.</p> |
