| 摘要 |
<p>PROBLEM TO BE SOLVED: To provide an apparatus for treating a substrate capable of simultaneously treating end faces of upper and lower surfaces of the substrate. SOLUTION: The apparatus (1) for treating the substrate comprises a chucking surface (22) having an injection port for injecting first gas. The apparatus (1) treats the substrate by supplying treatment liquid from above the rotating substrate by the first gas injected from the port while the substrate is rotatably holding by floating the substrate from the chucking surface (22). The apparatus (1) comprises pressure-averaging means (32, 38 and 42) for averaging the pressure of the gas injected from the port, and an annular opening (52) provided to surround the port to inject second gas. In this apparatus, the opening (52) is opposed to an air gap (53) under a lower surface of the substrate in such a manner that its tangential direction is disposed to form an acute angle radially outward and downward of the substrate.</p> |
