| 摘要 |
PROBLEM TO BE SOLVED: To improve the performance of metal foil with a resin having a resin layer on one side surface of the foil (e.g. copper foil) to be used to manufacture a build-up multilayer circuit substrate by using a thermosetting resin having excellent dielectric characteristics (low relative permittivity, low dielectric loss), high heat resistance, a low thermal expansion coefficient, and excellent processability in a B-stage state. SOLUTION: In the metal foil with the resin, as the resin, a condensed polycyclic aromatic resin in which an unsaturated group such as an allyl group or the like is introduced at least partly into an aromatic ring of the condensed polycyclic aromatic resin having a molecular structure in which a hydrocarbon aromatic ring in which at least a part is a condensed ring, is bonded via a methylene chain, is used solely or as a mixture of a crosslinkable diluent [e.g. triallyl(iso)cyanurate] and/or an epoxy resin. |
