| 摘要 |
PROBLEM TO BE SOLVED: To prevent the warpage of a TAB tape carrier prior to actually mounting an IC chip, etc., on the TAB tape carrier. SOLUTION: Recess parts 7 coated with a copper foil 6 are spaced in the longitudinal direction of a film base material 1 and warpage preventive agent 8 is filled in each recess 7. The warpage preventing agent 8 is a material having higher rigidity than the film base material 1 to prevent the warpage of the film base material 1. The warpage preventive agent 8 include metal such as copper, nickel, or the like, and the copper foil 6 is plated to fill the warpage preventive for example, material 8 in the recess 7.
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