SEMICONDUCTOR LASER DEVICE AND ITS MANUFACTURING METHOD

摘要

PROBLEM TO BE SOLVED: To provide a semiconductor laser device which is equipped with a semiconductor laser element that is mounted on a sub-mount while making its junction face down and improved in reliability. SOLUTION: A semiconductor laser device is equipped with a rugged P-side electrode 11 which is formed on the surface of a semiconductor laser element 150 that includes an MQW light emitting layer 4, a sub-mount 14 on which the semiconductor laser element 150 is mounted, and low-melting metal layers 13a and 13b which are provided between the P-side electrode 11 on the surface of the semiconductor laser element 150 and the sub-mount 14 and used for bonding the P-side electrode 11 on the surface of the semiconductor laser element 150 to the sub-mount 14.