| 摘要 |
PROBLEM TO BE SOLVED: To reduce man-hours and costs regarding the actual operation test of electronic equipment that includes electronic components requiring heat radiation, is composed on a substrate, and is accommodated in a housing. SOLUTION: A heat radiation member 18 that has heat radiation capability for enabling the actual operation of a semiconductor package 16 is mounted to the semiconductor package 16 that is an electronic component requiring heat radiation, and at the same time an opening 24 corresponding to the heat radiation member 18 is formed in a housing 14. Additionally, a completed substrate 12 can be incorporated into the housing 14 while the heat radiation member 18 is mounted to the semiconductor package 16. Further, when the completed substrate 12 is incorporated into the housing 14, the heat radiation member 18 is fitted to the opening 24 (a), the heat radiation member 18 nearly closes up the opening 24 (b), and one portion of the heat radiation member 18 is exposed outside the housing 14 via the opening 24 (c).
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