| 摘要 |
PROBLEM TO BE SOLVED: To solve the problem that a baking temperature is raised when the protective film of a semiconductor element is formed of lead system glass. SOLUTION: A mixture obtained by mixing aqueous ammonia to the water solution of the organic polymer matter having a carboxyl group is applied to the inclined side face 10 of a semiconductor substrate 1 composed of an n<+> -type semiconductor region 7, an n-type semiconductor region 8 and a p-type semiconductor region 9, and baking processing is conducted to form the protection film 6 having negative electric charge.
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