发明名称 |
HEAT DISSIPATION DEVICE RETENTION ASSEMBLY |
摘要 |
A method and apparatus to encourage correct operator assembly and disassembly of a component in a socket, and the component has a heat dissipation device attached to a substrate. A first embodiment of the invention involves a method to assemble a component and a heat dissipation device to a socket on a substrate using a retention assembly. A second embodiment of the invention involves a method to disassemble a component and a heat dissipation device from a socket on a substrate using a retention assembly. A third embodiment of the invention involves an assembled substrate with a retention assembly to limit operator ability to open and close a socket holding a component, relative to the engagement and disengagement of the retention assembly attached to the component.
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申请公布号 |
US2003053295(A1) |
申请公布日期 |
2003.03.20 |
申请号 |
US20010981146 |
申请日期 |
2001.10.16 |
申请人 |
BARSUN STEPHAN KARL;WILSON JEREMY IAN;AUGUSTIN THOMAS J. |
发明人 |
BARSUN STEPHAN KARL;WILSON JEREMY IAN;AUGUSTIN THOMAS J. |
分类号 |
H01L21/48;H05K7/14;H05K7/20;(IPC1-7):H05K7/20 |
主分类号 |
H01L21/48 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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