发明名称 |
Retaining ring interconnect used for 3-D stacking |
摘要 |
A retaining ring interconnect. A retaining ring is formed on a perimeter of a pad on each of two adjoining surfaces of two PCB substrates. A conductive paste is applied between the pads on the two adjoining surfaces. The retaining rings are aligned and facing with each other. By performing a heat compression process, the retaining rings are connected to encompass the conductive paste. A eutectic bond is thus formed to bond the two PCB substrates. |
申请公布号 |
US2003051903(A1) |
申请公布日期 |
2003.03.20 |
申请号 |
US20020117836 |
申请日期 |
2002.04.08 |
申请人 |
DENSE-PAC MICROSYSTEMS, INC. A CALIFORNIA CORPORATION |
发明人 |
ROETERS GLEN E.;MANTZ FRANK E. |
分类号 |
H01R12/04;H05K3/32;H05K3/40;H05K3/46;(IPC1-7):H05K1/03 |
主分类号 |
H01R12/04 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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